Our Technology
IH Reflow
Damageless Mounting Technology onto Low Heat Resistance Materials
With conventional mounting techniques such as solder reflow and ACF, heat resistance is highly required for substrates and devices. For this purpose, it is inevitable to use heat-resistant substrates such as glass with low flexibility and stretchability and expensive polyimide. Our core technology "IH Reflow" is a mounting technology that applies IH (Induction Heating), and enables only parts that need to be mounted instantaneously, without physical stress (non-contact), and without damage. This technology makes it possible to mount electronic components that are not heat-resistant, even on low-heat-resistant substrates such as PET, paper, and cloth that are inexpensive and flexible and stretchable. In addition, the application of this technology can dramatically increase production throughput as an alternative to mounting processes on high heat dissipation boards using conventional lasers and hand soldering.
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IH (Induction Heating) technology makes it possible to mount parts that require component mounting instantly and without applying physical stress to the substrate.
3D Touch Panel can be applied to new center console infotainment that is not in the conventional flat shape, and touch panels that take advantage of the characteristics of lightweight and hard-to-break resin.
Flexible LED Module technology enables new digital signage by mounting fine LEDs on PET films and papers.
Solution
IH Reflow EMS
Contract Manufacturing Service for Electronic Equipment based on IH Reflow
We are developing our original electronic equipment contract manufacturing service (EMS) based on the damage-less component mounting technology “IH Reflow”. This service can be applied for various production outsourcing needs such as new digital signages using flexible LED modules made of film and paper, component mounting on plastic moldings that contribute to weight reduction of automobiles, and mass production of prototype IoT/wearable devices with high design flexibility. In addition, IH Reflow Spot mounting can be used to support spot rework of electronic components.
NEWS |
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March 2021
We will exhibit at ILS2021 INNOVATION LEADERS SUMMIT.
Date: March 3 - 5, 2021
Place: Toranomon Hills
January 2021
We will exhibit at INTERNEPCON JAPAN.
Date: January 20 - 22, 2021
Place: Tokyo Big Sight (in the booth of SIIX)
December 2020
We will exhibit at FINETECH JAPAN.
Date: December 2 - 4, 2020
Place: Makuhari Messe (in the booth of SAKATA INX)
December 2020
We will exhibit at JFlex2021.
Date: December 9 - 11, 2020
Place: Tokyo Big Site Booth: 2W-M36
November 2020
The capital has been increased to 207,489,720 yen.
PR TIMES press release
We received an additional investment from REAL TECH FUND.
We received an investment from SAKATA INX CORPORATION.
October 2020
Our world's thinnest / lightest digital signage (FDS) has been selected for the Tokyo Startup BEAMS project.
September 2020
June 2020
We will exhibit at SID Display Week 2020.
Date: June 9 (Tue)-11 (Thu), 2020
Place: San Francisco Moscone Center
June 2020
We will exhibit at SID Display Week 2020.
Date: June 9 (Tue)-11 (Thu), 2020
Place: San Francisco Moscone Center
April 2020
We will exhibit at Digital Signage Japan 2020.
Date: April 13 (Mon)-15 (Wed), 2020
Place: Makuhari Messe
January 2020
We will exhibit at nano tech 2020.
Date: January 29 (Wed)-31 (Fri), 2020
Place: Tokyo Big Sight, in the booth of NEDO
January 2020
We will exhibit at JFlex2020.
Date: January 29 (Wed)-31 (Fri), 2020
Place: Tokyo Big Sight
January 2020
We will exhibit at INTERNEPCON JAPAN.
Date: January 15 (Wed)-18 (Sat), 2020
Place: Tokyo Big Sight, in the booth of KODENSHI CORP.
October 2019
We will exhibit at SEMICON Japan.
Date: December 11 (Wed)-13 (Fri), 2019
Place: Tokyo Big Sight
October 2019
We will exhibit at ILS Innovation Leaders Summit 2019.
Date: October 28 (Mon)-October 30 (Wed), 2019
Place: Toranomon Hills
December 2018
The head office registration has been changed.
New Address: C-5 Bldg. 9B, 1-21-5 Kandasugacho, Chiyoda-ku, Tokyo 101-0041 Japan
Phone: +81-3-6875-8528
Former Address: 3-29-8-101 Hiyoshihoncho, Kohoku, Yokohama, Kanagawa 223-0062 Japan
December 2018
We will exhibit at SEMICON Japan.
Date and Time: December 12 (Wed)-14 (Fri), 2018 10:00-17:00
Place: Tokyo Big Sight, East 3 Hall, INNOVATION VILLAGE # 3832 Revance Zone C1
December 2018
We will exhibit at the Highly-functional Film Expo.
Date and Time: December 5 (Wed)- 7 (Fri), 2018 10:00-18:00 (last day until 17:00)
Place: Makuhari Messe 4 Hall 21-2 (Nagase & Co., Ltd.)
October 2018
We have been selected and exhibited at ILS Innovation Leaders Summit 2018 “ILS TOP100 STARTUPS”.
Date and Time: October 22 (Mon), 2018 10:00-18:30
Place: Toranomon Hills, 5th floor Hall A1 “Next Generation Venture Show” A4
October 2018
We will exhibit at Monozukuri Matching Japan 2018 “Monozukuri Pavilion with Kanagawa 2018”.
Date and Time: October 17 (Wed)- 19 (Fri), 2018 10:00 - 17:00
Place: Tokyo Big Sight, East 5 Hall R-09-36
October 2018
We have received investment from Realtech Fund.
Real Tech Fund Website [NEWS]
Real Tech Fund Website [PORTFOLIO]
Real Tech Fund Website [Facebook]
Euglena Investment Co,.Ltd. Website
PR TIMES
September 2018
Posted in Chemical Industry Daily (September 27, 2018) Venture Exploration Corner
August 2018
July 2018
Homepage was renewed.
March, 2018
Tokyo Kanda Head Office was opened.
September 2014
USA Silicon Valley (California) Office was opened.
ACCESS
Wonder Future Corporation
【Head Office】
C-5 Bldg. 9B, 1-21-5 Kandasugacho, Chiyoda-ku, Tokyo 101-0041 Japan
【USA Silicon Valley (California) Branch Office】
19925 Stevens Creek Blvd #100, Cupertino, USA
By Train
Ginza Line - Kanda Station No. 6 Exit - 3 minutes by walk
JR - Kanda Station North Exit - 6 minites by walk
JR - Akihabara Station - Denkigai Exit - 5 minites by walk
JR - Ochanomizu Station - 7 minites by walk
Chiyoda Line - Shin-Ochanomizu Station - 6 minutes by walk
Matunouchi Line - Awajicho Station - 5 minites by walk
Toei-Shinjyuku Line - Ogawamachi Station - 4 minites by walk
CONTACT |
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